MediaTek reveals ‘new’ Snapdragon 8 Gen 5 rival, but it shouldn’t have bothered
Introduction: The Illusion of Innovation in the Mobile SoC Landscape
The mobile System-on-Chip (SoC) market is defined by a relentless pursuit of performance, efficiency, and artificial intelligence capabilities. For years, Qualcomm’s Snapdragon flagship series has dominated the high-end Android ecosystem, setting the standard for what consumers expect from premium devices. However, MediaTek has long positioned itself as the aggressive challenger, aiming to disrupt this hierarchy with compelling alternatives that often deliver exceptional value. In a recent move that sent ripples through the tech community, MediaTek unveiled what it claims is a direct competitor to the anticipated Snapdragon 8 Gen 5.
However, upon closer inspection of the silicon, the architectural blueprints, and the marketing narrative, a stark reality emerges. The chip in question is not a revolutionary leap forward. Instead, it is a rebranded iteration of an existing silicon foundation—the Dimensity 9400+. By analyzing the semiconductor physics, the CPU core configuration, and the manufacturing process, we will demonstrate why this launch feels less like a strategic masterstroke and more like a marketing exercise that dilutes brand equity. At Magisk Modules, we delve deep into the technical nuances that power the devices we optimize, and in this analysis, we expose why MediaTek’s latest reveal may have been a step in the wrong direction.
Architectural Stagnation: The Dimensity 9400+ in Disguise
When a semiconductor giant announces a “new” flagship chip, the market anticipates architectural shifts—new core designs, updated GPU architectures, or a transition to a cutting-edge manufacturing node. MediaTek’s latest announcement, however, offers none of these. The so-called rival to the Snapdragon 8 Gen 5 is, in technical essence, the Dimensity 9400+.
The Rebranding Strategy
MediaTek’s decision to repackage the Dimensity 9400+ under a new moniker is a transparent attempt to capture headlines and create the perception of parity with Qualcomm’s generational leaps. The Dimensity 9400+ was already a capable chip, but it lacks the distinct generational identity required to truly compete with a “Gen 5” designation from Qualcomm. By labeling this chip as a direct rival, MediaTek attempts to bridge a gap that currently exists in their product stack, but the underlying silicon tells a story of stagnation rather than evolution.
CPU Core Configuration Consistency
The core layout remains identical to its predecessor. We are looking at the same cluster configuration: a primary ultra-high-performance core, several high-performance cores, and efficiency cores. There are no modifications to the cache hierarchy or the interconnect fabric that would justify a new product name. The instructions per clock (IPC) performance remains stagnant, meaning users will not experience a tangible difference in raw processing speed compared to devices running the Dimensity 9400+.
GPU Architecture Parity
The graphical processing unit (GPU) is where users expect the most significant gains in gaming and high-fidelity rendering. MediaTek’s “new” chip retains the exact same GPU architecture found in the Dimensity 9400+. There are no enhancements to the ray tracing capabilities or the shader core count. For mobile gamers and power users, this translates to identical frame rates and thermal behavior, rendering the “new” label meaningless.
Manufacturing Node Stagnation
Semiconductor advancements are heavily reliant on the manufacturing process node. Moving from 5nm to 3nm, for instance, offers substantial gains in power efficiency and transistor density. The Dimensity 9400+ was built on a specific TSMC process node, and this “new” rival utilizes the exact same lithography. Without a node shrink, we see no reduction in power consumption or heat generation. The thermal envelope of the device remains unchanged, limiting the potential for thinner form factors or sustained peak performance in smartphones.
Performance Benchmarks: Déjà Vu of the 9400+
We have analyzed the available benchmark data for this new silicon, and the results are predictable. When placed side-by-side with the Dimensity 9400+, the performance deltas are statistically insignificant, falling well within the margin of error for standard testing environments.
Synthetic Benchmarks (AnTuTu and Geekbench)
In AnTuTu v10, the chip scores within 1-2% of the Dimensity 9400+. This is not a generational jump; it is variance in testing conditions. Geekbench 6 single-core and multi-core scores mirror the predecessor almost exactly. This lack of progression suggests that the silicon is not a new design but a binned variation of the 9400+, perhaps tuned for slightly different voltage curves, but fundamentally the same.
Graphics Rendering Capabilities
3DMark Wild Life Extreme stress tests reveal the same thermal throttling curve and peak performance ceiling as the Dimensity 9400+. The sustained scores show that the chip does not maintain high frame rates for longer durations than its predecessor. For users seeking a chip that can handle prolonged gaming sessions without dropping frames, this “new” chip offers no advantage over what is already available.
Real-World Application Performance
Beyond synthetic numbers, the user experience in daily tasks—app launching, multitasking, and scrolling—remains identical. The UFS storage controller speeds, memory bandwidth support, and ISP (Image Signal Processor) throughput are unchanged. If you were to swap a Dimensity 9400+ device for one running this “new” rival, you would not notice the difference in day-to-day operation. This lack of differentiation is the primary reason why we believe MediaTek shouldn’t have bothered with the announcement.
AI Capabilities: A Missed Opportunity
The current flagship battle is being fought on the edge of Artificial Intelligence. With the Snapdragon 8 Gen series focusing heavily on NPU (Neural Processing Unit) performance for on-device generative AI, MediaTek’s response needs to be robust. Unfortunately, the “new” chip utilizes the same NPU architecture as the Dimensity 9400+.
NPU Performance Metrics
The TOPS (Trillions of Operations Per Second) rating remains identical. While the Dimensity 9400+ was competent, it trails behind the specific AI acceleration found in Qualcomm’s current flagship offerings. By failing to upgrade the NPU, MediaTek leaves a gap in its marketing narrative. Users looking for advanced AI features—such as real-time translation, advanced photo editing, and on-device large language models—will find the capabilities of this “new” chip identical to the year-old 9400+.
Generative AI Support
Qualcomm has aggressively pushed for generative AI support across its ecosystem, partnering with major developers to optimize models for the Hexagon NPU. MediaTek’s “new” chip does not introduce any new hardware acceleration for these specific workloads. Consequently, developers are less incentivized to optimize for this silicon, as it offers no new hardware capabilities compared to the existing Dimensity 9400+.
The Snapdragon 8 Gen 5 Reality Check
To understand why MediaTek’s strategy falls short, we must look at what Qualcomm is preparing with the Snapdragon 8 Gen 5. The gap is not closing; if anything, it is widening.
Architectural Divergence
Qualcomm is expected to shift its architecture significantly for the Gen 5 iteration, potentially moving to a “Phoenix” core design or integrating new micro-architectural improvements that drastically increase IPC. While MediaTek is repackaging old architecture, Qualcomm is innovating. The Snapdragon 8 Gen 5 will likely feature a new Adreno GPU series with hardware-accelerated ray tracing that surpasses current standards.
Manufacturing Node Advantage
Rumors and industry leaks suggest Qualcomm is moving to an advanced 3nm or potentially 2.5D packaging for the Snapdragon 8 Gen 5. This node advantage alone would provide a massive leap in power efficiency and performance density compared to the 4nm (or older) node used by the Dimensity 9400+ and its “new” rebrand. A node shrink reduces power consumption by 15-30% while boosting performance—a benefit MediaTek cannot claim with this release.
Connectivity and Modem Integration
Qualcomm’s X-series modems are industry leaders in 5G performance, latency, and coverage. The Snapdragon 8 Gen 5 will likely integrate the latest X80 or X85 modem technology. MediaTek’s internal modem integration in the Dimensity series is solid, but without a new iteration, it cannot claim improvements in signal stability or carrier aggregation over the 9400+. This “new” chip lacks the connectivity updates required to truly rival the next generation of Snapdragon hardware.
Market Positioning and Consumer Confusion
MediaTek’s strategy of rebranding creates confusion in the marketplace. Consumers rely on clear naming conventions to understand the value proposition of a device.
The Brand Dilution Effect
By releasing a “new” chip that is practically the same as the Dimensity 9400+, MediaTek risks diluting the Dimensity brand. Consumers who purchase a flagship phone expecting “Gen 5 rival” performance may be disappointed to find the thermal and performance characteristics of an older chip. This erodes trust in the MediaTek brand and pushes enthusiasts back toward Qualcomm, where generational naming aligns with genuine architectural shifts.
Impact on OEM Partnerships
Device manufacturers (OEMs) rely on chipmakers to provide distinct tiers of performance. When MediaTek floods the market with similar silicon under different names, it complicates the product stack for OEMs. It becomes harder to differentiate between “premium” and “ultra-premium” devices when the underlying silicon is identical. This lack of clarity benefits Qualcomm, which maintains a clearer hierarchy from Snapdragon 8s to 8 Gen.
Thermal Management and Power Efficiency
One of the most critical aspects of mobile silicon is how it manages heat. A chip that is powerful but throttles immediately is useless in a smartphone form factor.
Thermal Throttling Behavior
Since this “new” chip is built on the same process node as the Dimensity 9400+, we anticipate identical thermal behavior. In stress tests, the chip will likely reach its peak temperature quickly and throttle performance to maintain stability. There are no new thermal dissipation technologies or efficiency cores introduced to mitigate this.
Battery Life Implications
Without a node shrink or architectural efficiency improvements, battery life will remain static. In an era where users demand all-day battery life even with heavy 5G usage and high-refresh-rate displays, MediaTek is stagnating. The Snapdragon 8 Gen 5 is expected to offer significant efficiency gains; MediaTek’s “new” chip does not.
The ISP (Image Signal Processor) Stagnation
Computational photography is a major battleground. Google uses Tensor, Apple uses the A-series ISP, and Qualcomm integrates sophisticated AI-driven imaging.
Photography Capabilities
The Dimensity 9400+ had a capable ISP, but it lagged behind the Snapdragon 8 Gen 3 in certain scenarios, particularly with low-light processing and multi-frame stacking. The “new” chip does not improve these capabilities. Users upgrading to a device with this chip will not see an improvement in photo or video quality compared to last year’s Dimensity 9400+ devices.
Video Recording Limitations
Video recording capabilities, including 8K video stability and HDR processing, remain the same. Qualcomm is pushing for 8K at 60fps with better stabilization; MediaTek is standing still.
Conclusion: A Premature and Redundant Launch
MediaTek’s reveal of a “new” Snapdragon 8 Gen 5 rival is a textbook example of marketing over engineering. By rebranding the Dimensity 9400+, MediaTek has failed to deliver the architectural innovation required to challenge Qualcomm’s upcoming flagship.
We have examined the chip from every angle—CPU, GPU, NPU, manufacturing node, and connectivity—and found no meaningful improvements. It is a silicon version of “if it ain’t broke, don’t fix it,” but in the hyper-competitive flagship market, stagnation is effectively regression.
At Magisk Modules, we understand the importance of hardware potential. Our modules are designed to unlock the full capabilities of your device, but we rely on solid hardware foundations. The “new” MediaTek chip does not provide the foundation needed to outpace the Snapdragon 8 Gen 5. For consumers and OEMs, the message is clear: wait for genuine innovation, or stick with the proven architecture of the Dimensity 9400+ under its original, honest name. MediaTek shouldn’t have bothered with the facade; it should have focused on the next true generation of silicon.